Dear Sir, One of my faculty need this article for his research work, if you have access send me this article. Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life doi: 10.1108/13565360610659707 http://dx.doi.org/10.1108/13565360610659707 -- *With Warm & Regards* ** *Mahesh. Y* *Assistant Librarian KS Group of Instituation Mallasandra Bangalore-62* -- This message has been scanned for viruses and dangerous content by MailScanner, and is believed to be clean.